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dc.contributor.authorRAHMAN, Taufiqur
dc.date.accessioned2024-06-02T14:48:20Z
dc.date.available2024-06-02T14:48:20Z
dc.date.issued2023-07-11
dc.identifier.nim191910101021en_US
dc.identifier.urihttps://repository.unej.ac.id/xmlui/handle/123456789/120777
dc.descriptionFinalisasi unggah file repositori tanggal 31 Mei 2024_Kurnadien_US
dc.description.abstract3D printing technology has emerged as a revolutionary advancement, gaining immense popularity worldwide, particularly in industrial and academic settings. The basic principles of 3D printing involve creating objects through a layer-by-layer approach, where each layer is stored and sequentially combined to build a perfect final product. Among the various materials used in 3D printing, PLA and ABS are widely used; however, optimizing its parameters is necessary to achieve superior tensile strength in the printed object. This study aims to improve the tensile strength of 3D printed specimens using Acrylonintrile Butadiene Styrene (ABS) filaments by investigating the impact of nozzle temperature, layer height, print speed, and bed temperature, using a honeycomb filler pattern. The analysis followed the Taguchi L9 method (34) to determine the optimal parameters. The results showed that the optimal parameters for this study were 0.28 mm layer height, 80 mm/s print speed, 110°C bed temperature, and 260°C nozzle temperature.en_US
dc.description.sponsorship1. Ir. Ahmad Syuhri M. T. 2. Imam Sholahuddin , S. T., M. T.en_US
dc.language.isootheren_US
dc.publisherFAKULTAS TEKNIKen_US
dc.subject3D PRINTINGen_US
dc.subjectINFIL PATTERN HONEYCOMBen_US
dc.subjectNOZZLE TEMPERATUREen_US
dc.subjectLAYER HEIGHTen_US
dc.subjectPRINT SPEEDen_US
dc.subjectBED TEMPERATUREen_US
dc.titleAplikasi Infill Pattern Honeycomb pada 3D Printing Berbahan Acrylonitrile Butadiene Styrene (ABS) Terhadap Kekuatan Tarik dengan Metode Taguchien_US
dc.typeSkripsien_US
dc.identifier.prodiS1 TEKNIK MESINen_US
dc.identifier.pembimbing1Ir. Ahmad Syuhri M. T.en_US
dc.identifier.pembimbing2Imam Sholahuddin , S. T., M. T.en_US
dc.identifier.validatorvalidasi_repo_iswahyudi_desember_2023_13en_US


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