Analysis of the effect 3D printing parameters on tensile strength using Copper-PLA filament
dc.contributor.author | DARSIN, Mahros | |
dc.contributor.author | MAULUDY, Renald Rochman | |
dc.contributor.author | HARDIATAMA, Intan | |
dc.contributor.author | FACHRI, Boy Arief | |
dc.contributor.author | RAMADHAN, Mochamad Edoward | |
dc.contributor.author | PARNINGOTAN, Doddy | |
dc.date.accessioned | 2022-04-20T03:11:57Z | |
dc.date.available | 2022-04-20T03:11:57Z | |
dc.date.issued | 2022-02-10 | |
dc.identifier.govdoc | NIDN#0001097406 | |
dc.identifier.govdoc | NIDN#0022037002 | |
dc.identifier.govdoc | NIDN#0001048903 | |
dc.identifier.uri | http://repository.unej.ac.id/xmlui/handle/123456789/106478 | |
dc.description.abstract | s research aims to find the optimal combination of parameters to obtain the maximum tensile strength of 3D printing products made of eCopper, which consists of 45% Cu and 55% PLA. The parameters used were nozzle temperature, layer height, print speed and bed temperature with three levels each. The Taguchi L9 (3^4) experiment was used for design and analysis. The product was printed in the form of a tensile test specimen according to the ASTM D638 Type I standard using a Cartesian FDM 3D printer. The average response S/N ratio calculation found that the highest tensile strength would be obtained when applying combination parameters of nozzle temperature 230 oC, layer height 0.35 mm, print speed 90 mm/s and bed temperature 60 oC. While each parameter contributes to the tensile strength by the order are nozzle temperature, layer height, print speed, and bed temperature 59.44%, 20.53%, 18.06% and 1.97%, respectively. | en_US |
dc.language.iso | en | en_US |
dc.publisher | SINERGI | en_US |
dc.subject | 3D printing | en_US |
dc.subject | Copper-PLA filament | en_US |
dc.subject | Taguchi method | en_US |
dc.subject | Tensile strength | en_US |
dc.title | Analysis of the effect 3D printing parameters on tensile strength using Copper-PLA filament | en_US |
dc.type | Article | en_US |
Files in this item
This item appears in the following Collection(s)
-
LSP-Jurnal Ilmiah Dosen [7356]
Koleksi Jurnal Ilmiah Dosen