Penurunan Kadar Tembaga (Cu) pada Limbah Cair Industri Elektroplating Menggunakan Cangkang Telur Ayam Potong Teraktivasi Termal

Please use this identifier to cite or link to this item: https://repository.unej.ac.id/xmlui/handle/123456789/84080

Title:	Penurunan Kadar Tembaga (Cu) pada Limbah Cair Industri Elektroplating Menggunakan Cangkang Telur Ayam Potong Teraktivasi Termal
Authors:	Ratnasari, Ninis Dian Moelyaningrum, Anita Dewi Ellyke, Ellyke
Keywords:	adsorption copper (Cu) electroplating waste chicken eggshell
Issue Date:	26-Jan-2018
Abstract:	Copper (Cu) heavy metal is produced from electroplating industry in its liquid waste. Eggshell has 7.000-17.000 pores and CaCO 3 that can be used as an adsorbent for adsorbing Cu. The purpose of this research was to analyze the differences of Cu levels between the liquid waste which was not given and which was given with broiler’s eggshell powder thermal activated at 600 0 C in concentration of 20 g/l, 25 g/l, and 30 g/l at 90 minutes contact duration. Type of this research was a true experiment.
Description:	Sanitasi: Jurnal Kesehatan Lingkungan, Vol. 9, No.2, November 2017, pp.56-62
URI:	http://repository.unej.ac.id/handle/123456789/84080
ISSN:	1978-5763
Appears in Collections:	LSP-Jurnal Ilmiah Dosen

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F. KM_Jurnal_Ellyke_Penurunan Kadar Tembaga.pdf		1.39 MB	Adobe PDF	View/Open

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