Please use this identifier to cite or link to this item: https://repository.unej.ac.id/xmlui/handle/123456789/101009
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dc.contributor.authorLINDRIATI, Triana-
dc.contributor.authorBASUKI, Hari Arbiantara-
dc.date.accessioned2020-09-22T01:57:14Z-
dc.date.available2020-09-22T01:57:14Z-
dc.date.issued2011-10-04-
dc.identifier.urihttp://repository.unej.ac.id/handle/123456789/101009-
dc.description.abstractEdible Films based on Canavalia Ensiformis flour could be made using compression molding process. This research was to investigate temperature (120 o C, 130 o C, 140 o C) and pressure ( 0.845 Mpa, 1.690 Mpa, 2.540 Mpa) effect on the properties of the film. The compression- molding pressure significantly affected the film’s thickness, lightness, tensile strength, elongation and Water Vapor Transmition Rate (WVTR). Meanwhile molding temperature only affected film’s elongation (P<0.05) over the range of conditions studied. Increase in compaction pressure resulted in decreased thickness, tensile strength, elongation with increase in lightness (L*) and WVTR. Increasing the molding temperature decreased elongation. Flexible, light-yellow edible films could be produced at a processing temperature of 140 o C and compaction pressure of 0.845 Mpa. The films thickness was 0.302 mm; lightness (L*) was 68.557, tensile strength was 4.091 Mpa, elongation was 37.547 % and WVTR was 0.001 mg/m 2 .det.en_US
dc.language.isoInden_US
dc.publisherJ. Teknol. dan Industri Pangan, Vol. XXII No. 1 Th. 2011en_US
dc.subjectedible filmen_US
dc.subjectCanavalia ensiformis flouren_US
dc.subjectcompression moldingen_US
dc.titlePengembangan Proses Compression Molding dalam Pembuatan Edible Film dari Tepung Koro Pedang (Canavalia ensiformis L.) [Development of Compression Molding Process for Edible Films Production from Canavalia ensiformis (L.) Flour]en_US
dc.typeArticleen_US
dc.identifier.kodeprodiKODEPRODI1710101#Teknologi Hasil Pertanian-
dc.identifier.kodeprodiKODEPRODI1910101#Teknik Mesin-
dc.identifier.nidnNIDN0014086803-
dc.identifier.nidnNIDN0024096708-
Appears in Collections:LSP-Jurnal Ilmiah Dosen

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